Solid or liquid adhesive: which TACK solution should you choose for your parts?
TACK 100 and TACK 200: two formulations for temporarily securing your flat parts.
TACK 100: the solid formulation
TACK 100 is supplied in solid form and has a melting point of 65 °C. It is available in a 450 g pack, under reference 06 TA0100 10.
TACK 200: precise dosing in liquid form
TACK 200 adhesive is particularly suited to small bonding areas that require precise dosing. Its liquid formulation hardens when heated to 65 °C. Debonding is carried out in an ultrasonic bath using 743 detergent.
It is available in a 100 g pack, under reference 06 TA0200 00.
Choosing for your application
Both formulations are designed to hold flat parts temporarily during lapping and polishing. To help select the right solution, specify your part material, the area to be bonded and your application and debonding requirements.
Let’s discuss your parts and your process.
The LAM PLAN team can help you choose a solution suited to your application.
+33 (0)4 50 43 96 30