For cold mounting metallographic samples under pressure

mm808 appareil de polymérisation
By avoiding entrapment of abrasives in bubbles, MM808 helps improve the polishing quality after mounting.
  • By avoiding entrapment of abrasives in bubbles, MM808 helps improve the polishing quality after mounting.
  • Height
    300 mm
  • Width
    305 mm
  • Depth
    400 mm
  • Weight
    8,6 kg
INTRODUCTION

M.M.808

M.M.808 creates a pressurized environment for polymerization to avoid bubbles in the mount without affecting the physical characteristics of the resin.
While M.M.808 can be used with all cold mounting resins, it is highly recommended to be used with transparent EPOXY RESINS 603 / 603.2 and ACRYLIC RESIN 609.
VIDEO & VISUALS

Design
and advanced technology

Additionally, using the M.M.808 unit for cold mounting elimi- nates the odors typical of cold mounting resins.
  • mm808

    Opening 1

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    Opening 2

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    Opening 3

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    Rear side

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    View from above

  • mm808

    Transparent EPOXY RESINS 603 / 603.2 and ACRYLIC RESIN 609

    Non-contractual images
    IN DÉTAILS

    Technical characteristics
    and equipment

    The benefits

    By avoiding entrapped bubbles in transparent mounts, the visibility of the sample can be improved.

    In all cold mounting resins, avoiding bubbles improve edge retention while grinding and polishing metallographic samples.

    By avoiding entrapment of abrasives in bubbles, MM808 helps improve the polishing quality after mounting.

    Scope of delivery

    • M.M.808 pressure polymerization device
    • Quartz timer
    • Operating manual
    • Nozzle

    Downloads

    Technical data M.M.808

    Pressure connection
    3 to 10 bar
    Nominal pressure
    2 bar
    Max. operating pressure
    2,8 bar
    Height
    300 mm
    Width
    305 mm
    Depth
    400 mm
    Weight
    8,6 kg
    Inner diameter of lid opening
    210 mm
    Inner diameter base
    225 mm
    Pressure pot height to cover edge
    190 mm
    Reference
    08 00808 20

    Capacity of the pressure pot

    Embedding mold Ø 25 mm
    30 pcs
    Embedding mold Ø 30 mm
    24 pcs
    Embedding mold Ø 40 mm
    15 pcs
    Embedding mold Ø 50 mm
    10 pcs

    Polymerization time

    Recommended times for LAM PLAN mounting resins:
    Resin 603
    1 h polymerization - (hardening 10 h)
    Resin 603.2
    20 min. polymerization - (hardening 2 h)
    Resin 605
    5 - 7 min.
    Resin 607
    16 - 20 min.
    Resin 665
    8 - 10 min.
    Resin 609
    9- 13 min.
    ACCESSORIES & OPTIONS

    Available accessories

    • Flexible cylindrical cold mounting moulds
    • Flexible rectangular cold mounting moulds
    • Moulds with removal bottom
    • Flexible cylindrical cold mounting moulds
      Available in all standard diameters for central and individual pressure sample holders, made of a flexible material to facilitate mould removal. (For an intensive use of the EPOXY 603 resin, it is preferable to use moulds with removable bottoms).
    • Flexible rectangular cold mounting moulds
      Specifically, for cold mounting resin, adapted to complex and nonstandard shapes, many dimensions available, made of a flexible material to facilitate mould removal, (For an intensive use of Epoxy 603, it is preferable to use removable bottom moulds).
    • Moulds with removal bottom
      Mainly used with the transparent mounting resins (601.2, 609, 603).
    Non-contractual images

    Assistance & information

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